Flagship Product
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Optical system and device all self-developed
Beam motion space programming
Patented process algorithms
(Patented technology)
Same power, much more cutting thickness
Same power and thickness, much more cutting speed
No beam reflection, also for the batch processing of highly reflective materials
Speed increases by 20% for thickness 6mm-12mm.
Speed increases by 60% for thickness 12mm-30mm.
Speed increases by 30% for thickness 8mm-30mm.
Speed increases by 80% for thickness above 10mm.
Maximum cutting thickness increases by 100%.
Maximum cutting thickness increases by 100%.
Speed increases by 50% for thickness above 8mm.
Maximum cutting thickness increases by 60%.
Speed increases by 50% for thickness above 6mm.
Maximum cutting thickness increases by 60%.
Speed increases by 40% for thickness above 6mm.
Maximum cutting thickness increases by 30%.
| Scanning cutting power | Applicable Model |
| 3000W | A C P G I H AT CT K |
| 6000W | A C P G I H AT CT K |
| 12000W | A C P G I H |
* Owing to the real-time updating of products and technologies, the datas and product pictures on the site are for reference only.
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